This is an outstanding hardware design position with participation in development of new technologies for rigid, flex, and substrate PCB designs across iPhone products under close collaboration with key cross functional partners in San Diego. Responsibilities include: Developing technology solutions at the PCB/module level that enable various product goals in cost, thermal performance, battery life, reliability, and environmental impact. Collaborating with technology teams exploring process improvements and materials that enable reductions in routing density, power loss, coexistence, and insertion loss while keeping solution dimensions the same or smaller. Contributing to cross functional system and module designs across antenna flexes, camera substrates, main logic board PCBs, and system flexes. There will also be opportunities for international travel.